Hieff™ LongSeq DNA Endprep&dA-Tail Module is a DNA end-repair and A-tailing module developed for the third-generation Nanopore sequencing platform. This kit features directionally engineered enzymes and optimized buffers, enabling efficient repair of various samples such as 100 ng-1.5 µg gDNA and amplicons. Moreover, purification is not required after end-repair and A-tailing; the product can be directly used for Barcode ligation, making the experimental workflow more convenient.

Features

Optimized for LongSeq Platforms: Specifically designed for end-repair and dA-tailing in Nanopore sequencing workflows.

High Efficiency: Superior enzymatic performance.

Wide Input Range: 100 ng – 1.5 μg (gDNA, amplicons, etc.).

Components

Figure

1. Human Genome Sequencing Case

2. Microbial genome Sequencing Case